JPS6351387B2 - - Google Patents
Info
- Publication number
- JPS6351387B2 JPS6351387B2 JP56037118A JP3711881A JPS6351387B2 JP S6351387 B2 JPS6351387 B2 JP S6351387B2 JP 56037118 A JP56037118 A JP 56037118A JP 3711881 A JP3711881 A JP 3711881A JP S6351387 B2 JPS6351387 B2 JP S6351387B2
- Authority
- JP
- Japan
- Prior art keywords
- comb
- groove
- metal powder
- cooling device
- brazed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003507 refrigerant Substances 0.000 claims description 23
- 238000001816 cooling Methods 0.000 claims description 16
- 238000005219 brazing Methods 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 5
- 239000011230 binding agent Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000002826 coolant Substances 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 12
- 239000007788 liquid Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 239000004264 Petrolatum Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229940066842 petrolatum Drugs 0.000 description 1
- 235000019271 petrolatum Nutrition 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56037118A JPS57152150A (en) | 1981-03-13 | 1981-03-13 | Cooler for semiconductor and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56037118A JPS57152150A (en) | 1981-03-13 | 1981-03-13 | Cooler for semiconductor and manufacture thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57152150A JPS57152150A (en) | 1982-09-20 |
| JPS6351387B2 true JPS6351387B2 (en]) | 1988-10-13 |
Family
ID=12488680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56037118A Granted JPS57152150A (en) | 1981-03-13 | 1981-03-13 | Cooler for semiconductor and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57152150A (en]) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6357517B1 (en) * | 1994-07-04 | 2002-03-19 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant |
| JP3487382B2 (ja) * | 1994-12-28 | 2004-01-19 | 株式会社デンソー | 沸騰冷却装置 |
| US6073683A (en) * | 1995-07-05 | 2000-06-13 | Nippondenso Co., Ltd. | Cooling apparatus using boiling and condensing refrigerant and method for manufacturing the same |
| JP3634028B2 (ja) * | 1995-09-08 | 2005-03-30 | 住友精密工業株式会社 | 半導体素子冷却装置 |
| US6119767A (en) * | 1996-01-29 | 2000-09-19 | Denso Corporation | Cooling apparatus using boiling and condensing refrigerant |
| FR2746177B1 (fr) * | 1996-03-14 | 2000-04-07 | Dispositif de refroidissement utilisant un refrigerant en ebullition et se condensant | |
| US6279649B1 (en) * | 1998-04-27 | 2001-08-28 | Denso Corporation | Cooling apparatus using boiling and condensing refrigerant |
-
1981
- 1981-03-13 JP JP56037118A patent/JPS57152150A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57152150A (en) | 1982-09-20 |
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